>  PRODUCTS  >  Data Center  > 

GF2F series high-speed FPC assembly

GF2F series high-speed FPC assembly
GF2F series high-speed FPC assembly
Introduction
  • Termination method is elastic Press-fit of “C” type contacts, 300 pin

  • 100 Ω matching differential impedance

  • Low in height, the board can rotate at a certain angle and is suitable for data transmission between boards in a narrow space

  • Transmission rate as high as10Gbps

Main technical performance

Mechanical

Insulating shell: liquid crystalline polymer(LCP)

Contacts: beryllium copper, local gold plated and nickel plated

Endurance: 100 cycles of crimping & removal

Vibration: sinusoidal vibration: required frequency 10~500Hz,sweep vibration (sine), acceleration 50m/s2  (5G)

Impact: acceleration 300m/s2 (30G), half-sine wave, impact time 11ms


Electrical

Rated current: 1A

Working voltage: 12V

Withstanding voltage: normal temperature 100VAC

Contact resistance: △ ≤10mΩ;initial value ≤30mΩ (excluding conductor volume resistance value)

Insulation resistance: ≥1000MΩ (100V DC)


Environmental

Working temperature: -40°C~ +105°C

Temperature life: 1000h under 105°C

Salt spray: 48h

Flame retardant grade: UL94 V-0


High-speed

Characteristic impedance: 100Ω

GF2F series of transmission rate: connector as high as 10Gbps

GF2F series of insertion loss: ≥-0.5db@2Gbps

GF2Fseries of return loss: ≤-20db@2Gbps

GF2Fseries of crosstalk loss: < -50db@2Gbps

GF2F series high-speed FPC assembly
Application

Main application fields:

  1. data network fields, such as enterprise routers, converters, memory, servers and supercomputers;

  2. telecommunications fields, such as communication base stations, core routers and converters.