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GF3P series high-speed backplane connector

GF3P series high-speed backplane connector
GF3P series high-speed backplane connector
Introduction
  • Termination method is Press-Fit

  • 92Ω matched differential impedance

  • It is suitable for high-speed data transmission between motherboard and daughter board

Main technical performance

Electrical

Dielectric withstand voltage: standard atmospheric pressure 500V AC (normal temperature)

Insulation resistance: normal temperature ≥1000 MΩ (500V DC)

Contact resistance: △ ≤10mΩ; initial value ≤30mΩ (excluding conductor volume resistance value)

Rated current: 1A

Rated voltage: 12V DC


Transmission

Transmission rate: 25Gbps

Characteristic impedance: 92±10Ω

Insertion loss: ≥-3dB (0GHz ~ 12.5GHz)

Return loss: ≤-10dB (0GHz ~ 12.5GHz)

Near-end crosstalk: ≤-30dB (0GHz ~ 12.5GHz)

Far-end crosstalk: ≤-30dB (0GHz ~ 12.5GHz)


Mechanical

Endurance: 200 cycles

Impact: half-sine wave, peak acceleration 490m/s2

Sine vibration: 10Hz - 500Hz, acceleration 98m/s2


Environmental

Working temperature: -40°C ~ 105°C

Salt spray: 48h


Ulmost

High temperature life: 105°C 1000h

Temperature shock: -55°C ~ 85°C, cycle times: 5

GF3P series high-speed backplane connector
Application

It is mainly applied in the following fields: 1. data network field, including enterprise routers, converters, storage, servers, supercomputers, etc.; 2. the field of wireless communication, including communication base stations, core routers, converters, etc.; 3. the new generation of integrated avionics system, fire control radar command and control system, image and sonar processing system, etc. will be popularized in aviation, aerospace, ship and other systems in the future.