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Termination method is BGA welding
90 Ω differential impedance
Suitable for data transmission between parallel PCB systems with plate spacing of 5mm, 8mm and 11mm
Transmission rate as high as 56Gbps PAM4
Designed with anti vibration and impact
Equipped with functions of mutual insertion
Small contacts, high density, the spacing between adjacent differential pairs per row is 4mm (the spacing between the signal contacts within the differential pair is 0.9mm and the spacing between adjacent signal contacts and grounding contacts is 0.9mm) and the spacing between two adjacent rows is 1.5mm
Electrical
Dielectric withstanding voltage: standard atmospheric pressure 500VAC
Insulation resistance: normal temperature≥1000MΩ
Contact resistance: ≤30mΩ (before environmental test); variation ≤10mΩ (after environmental test)
Rated current: 0.75A/pin (1oz PCB),1.2A/pin (2oz PCB)
Transmission
Transmission rate: 56Gbps PAM4
Characteristic impedance: 90±10%Ω
Comprehensive near-end crosstalk: ≤-40dB (0GHz~14GHz)
Comprehensive far-end crosstalk: ≤-40dB (0GHz~14GHz)
Insertion loss: ≥-1dB (0GHz~14GHz)
Return loss: ≤-15dB (0GH~7GHz), ≤-10dB (7GHz~14GHz)
Mechanical
Endurance: 100 cycles
Vibration: 20Hz ~ 500Hz, root mean square value of total acceleration: 3.1G
Impact: half-sine wave, peak value acceleration 294m/s2
Environmental
Working temperature: -55°C~ 105°C
MFG: EIA-364-65, Class II A, low level contact resistance variation ≤10mΩ
Ulmost
High temperature life: 240h,105°C
Temperature shock: -55°C~ 85°C, number of cycles 10
Main application fields:
1. data network fields, such as enterprise routers, converters, memory, servers and supercomputers;
2. telecommunications fields: such as communication base stations, core routers and converters. Comply with multiple protocol signals such as IEEE802.3 and OIF-CEI
