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GF5M series large offset high-speed sandwich connector

GF5M series large offset high-speed sandwich connector
GF5M series large offset high-speed sandwich connector
Introduction
  • The termination method is Press-Fit

  • Differential impedance of 85 Ω under high speed and 50 Ω under low speed

  • It is suitable for high-speed data transmission between a motherboard and a plug-in board

  • Transmission rate: up to 20Gbps

  • It can realize the separation of high-speed signal transmission and low-speed signal transmission, and realize two matching heights of 41mm and 83mm

  • Both plug and socket are rectangular connectors, and the plug adopts a symmetrical structure to realize undifferentiated matching between the plug and the socket

  • The contact is small with high density. The spacing between adjacent differential pairs in each column is 3.5mm (the spacing between signal contacts in the differential pair is 1.2mm, the spacing between adjacent signal contacts and ground contacts is 0.695mm), and the spacing between adjacent two columns is 3mm

Main technical performance

Electrical

Dielectric withstand voltage: standard atmospheric pressure 500V AC

Insulation resistance: normal temperature ≥1000MΩ

Contact resistance: ≤30mΩ (height between plates: 41mm), ≤50mΩ (height between plates:83mm) 

Rated current: high-speed contact: 0.5A/pin, low-speed contact: 2.0A/pin (the temperature rise of 72 pins adjacent to the connector shall not exceed 30 degrees at the same time)

Rated voltage: 12V DC or AC effective value


Transmission

Transmission rate: 20Gbps (UPI2.0)

Characteristic impedance: high-speed: 85±10%Ω; low speed: single end 50±10Ω

Near-end crosstalk (high speed only): ≤-35dB (0GHz ~ 12GHz); ≤-30dB (12GHz ~ 15GHz)

Far-end crosstalk (high speed only): ≤-35dB (0GHz ~ 12GHz); ≤-30dB (12GHz ~ 15GHz)

Insertion loss (high speed only): ≤2dB (0GHz ~ 10GHz); ≤3.5dB (10GHz ~ 15GHz)

Return loss (high speed only): ≤-10dB) (0GHz ~ 15GHz)


Mechanical

Endurance: 200 cycles

Random vibration: power spectral density 0.02G2/Hz, root mean square value of total acceleration 3.1G Impact: half-sine wave, peak acceleration 294m/s2


Environmental

Working temperature: -40°C ~ 105°C

Salt spray: 48h (gold plated area only)

Damp: alternate hot and humid 320h


Ulmost

High temperature life: 105h, 105°C

Temperature shock: -40°C~ 105°C, cycle times: 5

GF5M series large offset high-speed sandwich connector
Application

Main Application: mobile communication 6G platform rack server.